Interstitial Carbon in Copper: Electronic and Mechanical Properties
نویسندگان
چکیده
The effects of interstitial carbon on the electronic and mechanical properties of copper are studied theoretically. Semiempirical methodology, atomistic simulations, and first-principles density functional embedded cluster schemes are combined to extract some understanding of the diffusion process and related degradation of Cu/C composite materials under extremes of temperature and stress. High-resolution scanning electron microscopy results are presented, which demonstrate the existence of a solid solution zone at the Cu/C interface. * On leave of absence from Inst. de Física-UFBa, 40210-340 -BRAZIL
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